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How to Do Failure Analysis on Semiconductor Parts and Components
Home » Industrial Equipment » Failure Analysis » How to Do Failure Analysis on Semiconductor Parts and ComponentsSince most businesses fall into the category of electronic assembly of PC boards, (for various industries including the airlines, automobiles, and more), this topic will cover how failure analysis will work with semiconductors. Here are typical steps involved:
• Isolation: Just as with procedures above for visual inspections, the goal here is to isolate components so as to determine whether any are good or not. This is especially important for any components that actually failed. By isolating every component, you stand a better job of finding the defect so as to eliminate it for good.
• Verification: With this step, you have to verify that the component did indeed fail. The way to do that is by taking measurements to determine whether or not the part is good or bad. Testing equipment would be used here to determine this.
• X-Ray Radiography: What better way to find a defective part than by putting it under the eye of an X-ray machine. This way a careful inspection of the board may find defects in the materials that are etched into the board. If this is the case, a new board is in order. However, if the board is in good condition, the actual parts themselves can be inspected at closer range to determine their status.
• External Cleaning: Many times a thorough outside cleaning of the board, component, or equipment can detect a defect of some type. So this is always recommended before any type of operation is followed. Usually the parts or components are washed in special detergents to prevent damage to parts and board.
These are not by all means all the tests, because there are more. But the basis for these tests is to discover the reason for the failure as well as the cause of it. This way, a suitable solution can be drawn to eliminate this defect so this failure is not repeated.
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- Failure Analysis Overview
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- How to Perform Failure Analysis
- How to Do Failure Analysis on Semiconductor Parts and Components